Science Blog about Microelectronics of Fraunhofer IZM

Category - Semiconductors

Using 3D integration of components, complex, heterogeneous system-in-packages (SiP solutions) can be developed.

The major advantages of 3D system architecture include the high miniaturization and improved form factor. It also includes Improved performance and power efficiency. This is due to the faster signal speeds and higher bandwidth via shorter and narrower signal paths. 3D system architecture also increases functionality due to heterogeneous integration of components. Those components are fabricated using various technologies (sensor, memory, ASIC and transceiver).

Fraunhofer IZM’s services include a closed process chain – concept and process development, characterization, as well as reliability assessment and prototyping of 3D systems. All processes required throughout the chain for the realization of wafer-level packages, including through silicon via (TSV) formation, are available in our labs.

3D systems that meet the disparate target profiles demanded by various application scenarios, such as image sensors, sensor nodes, eGrains, can be realized and characterized. We work in close cooperation with tool and material suppliers to continuously improve applied technologies.