Flip-Chip

Chip-to-chip or chip-to-subtrate (e.g. laminates, thinfilm ceramics) can offer Flip-Chip Assembly. Chip-to-wafer assembly especially dedicated for 3D integration is possible for wafers up to 300 mm in diameter. Beside permanent die attach the Institute developed temporary die bonding methods to form artificial reconfigured wafers for wafer-to-wafer bonding. The team also developed Solutions for thin chip handling, as well as for very small chips by collective bonding methods.

Due to great progress in material and process development in the field of adhesive bonding technology, it now accounts for a growing share of joining technologies, e.g. alongside soldering processes. The result is the spread of application fields for adhesive bonding technology. These range from so-called low-cost products in consumer electronics to high-tech applications, e.g. in medical technology. The focus is on the application and development of flip chip bonding technologies. The basis for that are the following processes: ansiotropic conductive adhesive, non conductive adhesive or isotropic conductive adhesive.

 

PIXEL DETECTORS – THE SMALLEST PIECES IN THE WORLD’S LARGEST PARTICLE COLLIDER

Pixel detectors made by Fraunhofer IZM are used in one of the largest and best known scientific centers worldwide. Since the discovery of the Higgs Boson in 2012, the researchers at CERN have been pursuing other groundbreaking discoveries. Thomas Fritzsch…