Semiconductors

In the business field of semiconductors at Fraunhofer IZM, the focus lies on the integration and the manufacture of sensors. 3D integration enables the realization of complex, heterogeneous System-in-Package solutions.

The major advantages of 3D system architecture include the high miniaturization and improved form factor. It also includes Improved performance and power efficiency. This is due to the faster signal speeds and higher bandwidth via shorter and narrower signal paths. 3D system architecture also increases functionality due to heterogeneous integration of components. Those components are fabricated using various technologies (sensor, memory, ASIC and transceiver).

Fraunhofer IZM’s services include a closed process chain – concept and process development and characterization. Additionally, reliability assessment and prototyping of 3D systems. Our labs provide all processes required throughout the chain for the realization of wafer-level packages. This includes silicon via (TSV) formation. Image sensors, sensor nodes and eGrains are some examples for various application scenarios. The realization and characterization of those 3D systems that meet the disparate target profiles is possible at Fraunhofer IZM.

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