Electronic packaging is the core of any electronic product. Fraunhofer IZM develops what is almost invisible and underestimated by many: Assembly and interconnection technology, also known as electronic packaging. It is at the heart of every electronic application. Our technologies connect the individual components, protect against vibration or moisture and reliably dissipate heat.
Welcome to our list of three disruptive technologies in microelectronics. This post will let you discover the trends that will significantly change the global technological development. Chips Embedded in Substrate It is hard to miss the unbroken trend towards ever-smaller…
Welcome to our list of the IZM´s breakthrough technologies. In this post, you can learn about the four hallmark technologies in the field of microelectronics developed by Fraunhofer IZM that have the greatest potential or are already in widespread use…
