About RealIZM

RealIZM is a science blog focused on microelectronics that presents research at the Fraunhofer Institute for Reliability and Microintegration IZM in an accessible format. The blog provides insights into current developments in electronic packaging, system integration, and innovative technologies, making complex research available and engaging for experts and interested readers alike. Particular focus is placed on combining scientific depth with clear, accessible communication. More information

The Fraunhofer science blog RealIZM covers key topics in microelectronics, such as electronic packaging, system integration, semiconductor development, and sustainable electronics. In addition, it highlights specific applications in fields ranging from mobility and medical technology to communications. The posts cover technological fundamentals and current research projects as well as their relevance for industry.

Go directly to examples:
– Blog posts on packaging technologies
– Posts on applications in medical technology

RealIZM by Fraunhofer IZM is written for experts from industry and academia as well as the general readership interested in technology. It is particularly relevant for companies and organizations involved in microelectronics, system integration, and innovative technologies. The blog provides insight into current research trends and supports the transfer of knowledge between research and application. Discover all content

With RealIZM, Fraunhofer IZM makes research on microelectronics, electronic packaging, and system integration accessible to a broad specialist audience. The blog promotes the sharing of knowledge between science and industry and provides information about current developments, innovative technologies, and future applications for electronic systems.

Electronic packaging connects electronic components into reliable high-performance systems and is crucial for protection, thermal management, and miniaturization. To this end, metallic interconnection technologies are used in combination with glass, as well as ceramic and organic materials. At Fraunhofer IZM, we are researching innovative technologies such as hybrid bonding, fan-out wafer-level packaging, and silicon interposers for applications in AI, 5G/6G, quantum technologies, and chiplet systems.

System integration describes the reliable interaction of all components within an electronic system. Chips, sensors, memory, and printed circuit boards are connected in such a way that they work together reliably and efficiently. To this end, Fraunhofer IZM develops innovative integration and packaging technologies that enable modern applications in mobility, medical technology, communications, and industry.

Fraunhofer IZM develops technologies for system integration, electronic packaging, and reliable microelectronics. Key research areas include chiplet architectures, heterogeneous integration, and innovative assembly and interconnection technologies for mobility, medical technology, communications, and industry applications as well as for groundbreaking technologies like artificial intelligence. More information