Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM

Tag - Wafer-Level Packaging (WLP)

Wafer-Level Packaging (WLP): An approach to electronic packaging in which packaging and interconnect technologies are implemented directly on the wafer. Additional thin-film interconnects enable higher integration density and the integration of additional active or passive components. At Fraunhofer IZM, wafer-level technologies are being further developed for CMOS, sensor, and MEMS applications, as well as for modern 3D integration and system-in-package concepts.