Wafer Level Packaging

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

Rechargeable Bees? The Surprising Uses of Miniature Batteries

Fraunhofer IZM is pushing the boundaries for extremely small lithium-ion batteries, with the tiniest battery coming in at only one square millimetre. These super-small batteries are used in tiny in-ear devices or, unexpectedly, on the backs of worker bees. Robert…

Meet 6G’s Future with Holographic Communication

5G is not fully rolled out yet, but Fraunhofer IZM is already pursuing research on 6G communication modules. As these modules must be distributed more densely, the hardware has to become more compact. Finding the right way to miniaturize modules…

From Idea To Product Sample in one Year – The Philosophy of Fraunhofer IZM-ASSID

Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) is a dedicated business unit of Fraunhofer IZM located in Dresden/Moritzburg, Saxony. With its 300 mm wafer-level packaging process line, its mission is to develop custom system integration technologies for industrial partners, with…

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

PIXEL DETECTORS – THE SMALLEST PIECES IN THE WORLD’S LARGEST PARTICLE COLLIDER

Pixel detectors made by Fraunhofer IZM are used in one of the largest and best known scientific centers worldwide. Since the discovery of the Higgs Boson in 2012, the researchers at CERN have been pursuing other groundbreaking discoveries. Thomas Fritzsch…

IS HETEROGENEOUS INTEGRATION A PANACEA FOR THE ELECTRONICS INDUSTRY?

According to experts, heterogeneous integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries, vying for competitive advantages in their market…

WILL CHIPLETS REVIVE MOORE’S LAW?

Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…