Panel Level Packaging

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

IS HETEROGENEOUS INTEGRATION A PANACEA FOR THE ELECTRONICS INDUSTRY?

According to experts, heterogeneous integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries, vying for competitive advantages in their market…

WILL CHIPLETS REVIVE MOORE’S LAW?

Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…