Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM

Tag - System-in-Package (SiP)

System-in-Package (SiP): An approach to heterogeneous integration in which different electronic functions are combined within a single package. Unlike a System-on-Chip (SoC), the individual functions do not have to be fabricated on a single chip. This allows for the flexible combination of different semiconductor technologies. At Fraunhofer IZM, SiP technologies form an important foundation for modern electronic packaging, chiplet architectures, and highly integrated electronic systems.