Dr. Michael Töpper

Michael Töpper has an M.S. degree in chemistry and a Ph.D. degree in material science. Since 1994, he has been with the Packaging Research Team at TU Berlin and Fraunhofer IZM. In 1997, he became head of a research group there. In 2006, he was also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah and was teaching 10 years at TU-Berlin. The focus of his work has been wafer-level packaging applications as they relate to materials. Since 2015 he is business developer at Fraunhofer IZM. Michael Töpper is a Senior Member of IEEE-CPMT, now IEEE-EPS.

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

THREE DISRUPTIVE TECHNOLOGIES IN MICROELECTRONICS

Welcome to our list of three disruptive technologies in microelectronics. This post will let you discover the trends that will significantly change the global technological development. Chips Embedded in Substrate It is hard to miss the unbroken trend towards ever-smaller…

FOUR BREAKTHROUGH SOLUTIONS FROM FRAUNHOFER IZM

Welcome to our list of the IZM´s breakthrough technologies. In this post, you can learn about the four hallmark technologies in the field of microelectronics developed by Fraunhofer IZM that have the greatest potential or are already in widespread use…

WILL CHIPLETS REVIVE MOORE’S LAW?

Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…