Dipl.-Phys. Rolf Aschenbrenner, Erik Jung, Author at RealIZM |

Dr. Michael Töpper

Michael Töpper has an M.S. degree in chemistry and a Ph.D. degree in material science. Since 1994, he has been with the Packaging Research Team at TU Berlin and Fraunhofer IZM. In 1997, he became head of a research group there. In 2006, he was also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah and was teaching 10 years at TU-Berlin. The focus of his work has been wafer-level packaging applications as they relate to materials.
From 2015 to 2021, he was a Business Developer at Fraunhofer IZM. He has been Senior Specialist for Business Field Development at Forschungsfabrik Mikroelektronik Deutschland (FMD) since late 2021.