Heterogeneous Integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries. Especially for those vying for competitive advantages in their market and trying hard to stay cost-effective.
“Heterogeneous integration is the opposite of what we call monolithic integration. This approach puts as many functionalities as possible into one single chip. The manufacturing process of the chip is seamless. It turns out that this approach provides the best scaling prospects. This means the lowest cost per area. it’s only feasible for large fabrication runs due to the complexity. It is also limited to functions that can be built together in the same fabrication process.
Heterogeneous integration, similarly, uses special integration techniques to bring the various functional blocks together in a form factor that is not unlike a System on Chip (SoC). However, it gives you substantially more freedom when it comes to selecting the functionalities you would like to integrate.“ (Erik Jung on Real IZM)
The future of microelectronics faces exciting developments and important trends. But how will this technological sector develop in the coming years? Which application areas will significantly drive 2.5D/3D hetero-integration and high-end performance packaging, and where are the limits of what…
Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) is a dedicated business unit of Fraunhofer IZM located in Dresden/Moritzburg, Saxony. With its 300 mm wafer-level packaging process line, its mission is to develop custom system integration technologies for industrial partners, with…
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According to experts, heterogeneous integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries, vying for competitive advantages in their market…
