Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM

Tag - Heterogeneous Integration

Heterogeneous integration: The combination of different technologies and components into a single electronic system. Unlike monolithic integration, not all functions need to be fabricated on a single chip. This allows optimally designed components to be combined into particularly high-performance, energy-efficient, and compact systems. To this end, Fraunhofer IZM develops technologies ranging from chiplet architectures to 2.5D and 3D integration solutions.