Information & Communication

Information and communication technology faces new challenges, because of the new era of increasing connectivity and digitalization. The efficient sharing and storing of data need ever larger data centers and the means to transmit electric and optical signals. Digitalization itself brings its own challenges: There is increasing demand for highly dynamic networks that can transport, process, and analyze data.

Fraunhofer designs integrated, miniaturized, autonomous, and robust sensor systems and wireless networks and constructs high-frequency systems and electro-optical components. The provided services also include the optimization of processes and transfer of construction technologies for highly integrated systems, reliability testing and service life forecasting and consulting and eco-design services for sustainable ICT products.  

Sustainable electronics made in Germany: The Green ICT Competence Center

RealIZM blog series »Green ICT« – Part 3 In 2022, the Research Fab Microelectronics Germany (FMD) set up the »Green ICT @ FMD« competence center as a central point of contact for companies, SMEs and start-ups concerning »sustainable electronics«. Fraunhofer…

Fraunhofer IZM study shows trend reversal in the demand for electricity in Germany’s ICT sector by 2033

RealIZM blog series »Green ICT« – Part 2 There are currently signs of a trend reversal in the demand for electricity in ICT. According to calculations carried out by Fraunhofer IZM, the annual demand for electricity in ICT is rising…

Threats and protection mechanisms for the trustworthiness of electronic hardware

RealIZM blog series “Hardware security” – Part 1 With increasing globalization and more complex supply chains, electronic hardware is also becoming more susceptible to manipulation. Jan Hefer, a member of the RF & Smart Sensor Systems department, is working hard…

A question of design: How form and functions support moderate and sustainable smartphone use

RealIZM-Blog-Series “Integrative Circular Economy” – Part 3 Smartphones are both a curse and a blessing. A blessing because they offer us security and enable us to contact our loved ones anytime and anywhere, quickly retrieve information and news, reach any…

MODEST CUBE: A vision of sustainable smartphone product design

RealIZM-Blog-Series “Integrative Circular Economy” – Part 2″ Most high-end smartphones have one thing in common – they all look very similar. Take any device from a leading manufacturer, and you will see  a powerful camera, a large display, and generally…

What makes modular smartphones sustainable for different user groups?

RealIZM-Blog-Series “Integrative Circular Economy” – Part 1 The average working life of a smartphone among the over-16s in Germany lasts only around 7 to 12 months. Users opt for newer models as a result of the fast innovation cycles, driven…

Berlin Center for Digital Transformation: Digitization Solutions for Industry 4.0 and IIoT

The four Fraunhofer institutes – Fraunhofer FOKUS, Fraunhofer HHI, Fraunhofer IPK, and Fraunhofer IZM – have been cooperating under the umbrella of the Berlin Center for Digital Transformation since 2017, pooling their expertise in the fields of information and communication…

ICT: How can digital technologies become greener?

At the beginning of March, the ministry invited the project partners to the online conference “Green ICT 2023 – Sustainable Information and Communication Technologies”. In the run-up to this conference, RealIZM spoke with Dr. phil. Lutz Stobbe, head of the…

High speed with optical signals: Will the printed circuit board of the future be made of glass?

The backbone of our digital world is made of glass: A network of optical fibers spans the globe and lets data criss-cross our globe. We also experience the digital world through a pane of glass: We interact with the online…

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…