Jan Hefer studied mechanical and electrical engineering in Hanover, Dortmund and Berlin. After graduating in 2003, he initially worked as a research assistant at the TU Berlin at the Berlin Center of Advanced Packaging (BeCAP). In 2005, he moved to Fraunhofer IZM, where he became head of the Advanced System Development working group in the System Design & Integration department in 2006.
Since mid-2015, he has coordinated various large collaborative projects and has headed Fraunhofer IZM's "Trustworthy Electronics" task force since 2021. His research interests lie in the areas of energy self-sufficient microsystems, wireless sensor systems and data loggers, energy efficiency of electronic systems and trustworthy electronics.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication