Jan Hefer studied mechanical and electrical engineering in Hanover, Dortmund and Berlin. After graduating in 2003, he initially worked as a research assistant at the TU Berlin at the Berlin Center of Advanced Packaging (BeCAP). In 2005, he moved to Fraunhofer IZM, where he became head of the Advanced System Development working group in the System Design & Integration department in 2006.
Since mid-2015, he has coordinated various large collaborative projects and has headed Fraunhofer IZM's "Trustworthy Electronics" task force since 2021. His research interests lie in the areas of energy self-sufficient microsystems, wireless sensor systems and data loggers, energy efficiency of electronic systems and trustworthy electronics.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
