Science Blog about Microelectronics of Fraunhofer IZM

Tag - Cost Model

The advantages of cost models for packaging processes are countless. The intention is to optimize panel-level packaging at the process level through cost modellingl. A packaging process optimized already at the R&D stage has many benefits to offer, not just by saving costs, but also by having a positive impact on the environment. In our interview, Mathilde talks about the opportunities and challenges of cost modelling.