System-in-Package (SiP)

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

THREE DISRUPTIVE TECHNOLOGIES IN MICROELECTRONICS

Welcome to our list of three disruptive technologies in microelectronics. This post will let you discover the trends that will significantly change the global technological development. Chips Embedded in Substrate It is hard to miss the unbroken trend towards ever-smaller…

IS HETEROGENEOUS INTEGRATION A PANACEA FOR THE ELECTRONICS INDUSTRY?

According to experts, heterogeneous integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries, vying for competitive advantages in their market…

WILL CHIPLETS REVIVE MOORE’S LAW?

Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…