Maik Hampicke studied electrical engineering at the Technical University Berlin with a major in Electronic Systems. Afterwards he worked on the DFG project SENTHA, focusing on speech recognition and communication systems before completing his doctorate on the topic of optimization of smart home systems at the Technical University Cottbus. He then worked in a small-medium enterprise developing and deploying broadband networks.
Since 2007 he has been part of the Fraunhofer IZM, starting in the Application Center — responsible for the development of new application areas of microsystems technology in various industry fields and the management of development projects — before transitioning to Institute Management, where he was consultant, responsible for the coordination of internal research programs, the development of overarching projects and the cooperation with the research focus “Technologies of Microperipherals” at TU Berlin.
Since the beginning of the year 2023, he has taken over the lead office management position of the Digital Networking Performance Centre. The Center of Excellence is a merger of the four Berlin Fraunhofer Institutes tasked, among other things, with promoting the transfer of digitization solutions from the institutes to the economy.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication