Bump Bonding

Bump bonding at Fraunhofer IZM. The institute has the advantage that it has both main steps available in house: the bumping on wafer level and the flip chip assembly. So, we can offer the whole chain from wafer processing to bare module assembly.

PIXEL DETECTORS – THE SMALLEST PIECES IN THE WORLD’S LARGEST PARTICLE COLLIDER

Pixel detectors made by Fraunhofer IZM are used in one of the largest and best known scientific centers worldwide. Since the discovery of the Higgs Boson in 2012, the researchers at CERN have been pursuing other groundbreaking discoveries. Thomas Fritzsch…