Thomas Fritzsch received the diploma degree (M.Sc.) in electrical engineering from the University Dresden, Germany, in 1997.
Since 2001 he has been with the Fraunhofer Institute for Reliability and Microintegration Berlin, Germany. He is head of the group BeOL-, TSV- and Bump-Metallization. He is working as R&D engineer and project manager in the field of advanced wafer level packaging solutions with focus on pixel detector and sensor packaging applications.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication