Thomas Fritzsch

Thomas Fritzsch received the diploma degree (M.Sc.) in electrical engineering from the University Dresden, Germany, in 1997. Since 2001 he has been with the Fraunhofer Institute for Reliability and Microintegration Berlin, Germany. He is head of the group BeOL-, TSV- and Bump-Metallization. He is working as R&D engineer and project manager in the field of advanced wafer level packaging solutions with focus on pixel detector and sensor packaging applications.

Pixel Detectors – The Smallest Pieces in the World’s Largest Particle Collider

Pixel detectors made by Fraunhofer IZM are used in one of the largest and best known scientific centers worldwide. Since the discovery of the Higgs Boson in 2012, the researchers at CERN have been pursuing other groundbreaking discoveries. Thomas Fritzsch…