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RealIZM - Fraunhofer Blog about Microelectronics: Female scientists at Fraunhofer IZM
RealIZM: Our top-5 posts by female scientists at... 0 Comments:

RealIZM: Our top-5 posts by female scientists at Fraunhofer IZM

Posted in Medical Engineering, RealIZM, Reliability of Electronic Systems, Wearable & Conformable Electronics Published on 09/03/2023 Authors Katja Arnhold

Even today, women remain underrepresented in science and in research-driven industry. At Fraunhofer IZM, women account for 29.3 % of all employees, with a greater proportion of women in non-scientific (50 %) than in science jobs (23.8 %).* To counter…

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Tagged e-textiles & smart textiles, Medicine, Photonic Integration, Reliability of Electronic Systems, Sustainable electronics, Wafer Level Packaging
60 GHz Radar sensor for gesture control. Fraunhofer IZM
How do you develop the best radar systems... 0 Comments:

How do you develop the best radar systems in the world for the application in question?

Posted in Automotive/Transportation, Industrial Electronics, Sensor Systems Published on 16/02/2023 Authors Dr. Christian Tschoban, Paul Perlwitz and Katja Arnhold

Creating the best radar systems in the world for the application in question is an ambitious undertaking, But Dr. Christian Tschoban and Paul Perlwitz from Fraunhofer IZM are working on nothing short of that goal: The two scientists have developed…

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Tagged Sensor Systems
Tauchgang des Robo-Mantas, Bild: Evologics GmbH
A bionic sensor skin for semi-autonomous... 0 Comments:

A bionic sensor skin for semi-autonomous service robots in challenging land and underwater applications

Posted in Industrial Electronics, Sensor Systems, Wearable & Conformable Electronics Published on 26/01/2023 Authors Karl-Friedrich Becker, David Schütze and Katja Arnhold

A 50,000 square meter artificial reef off the Baltic coast and a green space following the trajectory of the Berlin Wall: Two places, about 240 km apart from each other and as different as could be. However, only a few…

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Tagged e-textiles & smart textiles, Embedding, Sensor Systems
Start-a-Factory at Fraunhofer IZM
Start-a-Factory at 5: A Modular Hardware... 0 Comments:

Start-a-Factory at 5: A Modular Hardware Development and Production Lab

Posted in Industrial Electronics, Start-ups at IZM, Wearable & Conformable Electronics Published on 05/01/2023 Authors Ulf Oestermann, Alexandra Rydz and Katja Arnhold

The borough of Wedding, situated in the north of Berlin, gets the hearts of electronics enthusiasts, startup entrepreneurs, and the R&D teams of SMEs racing. Since the end of 2017, Start-A-Factory (SAF) at Fraunhofer IZM has been offering a unique…

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Tagged 3D-Printing, e-textiles & smart textiles, Sustainable electronics
Single layer glass printed circuit board and optical fibers integrated in glass, Fraunhofer IZM
High speed with optical signals: Will the... 0 Comments:

High speed with optical signals: Will the printed circuit board of the future be made of glass?

Posted in Automotive/Transportation, Industrial Electronics, Information & Communication, Semiconductors Published on 15/12/2022 Authors Julian Schwietering and Katja Arnhold

The backbone of our digital world is made of glass: A network of optical fibers spans the globe and lets data criss-cross our globe. We also experience the digital world through a pane of glass: We interact with the online…

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Tagged Autonomous Driving, Photonic Integration, Sensor Systems
Textilband mit integrierten isolierten Leitern und Elektronikmodulen, Textile Prototyping Lab
First interdisciplinary research laboratory for... 0 Comments:

First interdisciplinary research laboratory for high-tech textiles and textile-integrated electronics

Posted in Wearable & Conformable Electronics Published on 24/11/2022 Authors Sigrid Rotzler and Katja Arnhold

The Textile Prototyping Lab (TPL) is the first interdisciplinary research lab for high-tech textiles and textile-integrated electronics. In the autumn of 2021, the innovation lab at Fraunhofer IZM in Berlin-Wedding was added to the laboratory space at the Berlin Weißensee School…

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Tagged e-textiles & smart textiles
Wafer-level system integration on 300mm
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Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

Posted in Automotive/Transportation, Information & Communication, Semiconductors Published on 03/11/2022 Authors Dr. Manuela Junghähnel and Susann Thoma

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

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Tagged Wafer Level Packaging
Sustainable mobile devices for the environment: Long live smartphones and tablets!
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Sustainable mobile devices for the environment: Long live smartphones and tablets!

Posted in Information & Communication, Micro-Batteries, Reliability of Electronic Systems Published on 13/10/2022 Authors Karsten Schischke, Katja Arnhold and Jacqueline Kamp

Mobility matters for people and their devices, but increasingly, so does sustainability. But smartphones, tablets, and the like generate considerable carbon emissions when they are produced and when they are used. In addition, valuable raw materials are used to make…

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Tagged Energy Labels, Life Cycle Assessment of Electronics, Sustainable electronics
Prize: The first microelectronics Blog at Fraunhofer
Science Communication as a Catalyst for... 0 Comments:

Science Communication as a Catalyst for Innovation in Microelectronics

Posted in RealIZM Published on 22/09/2022 Authors Prof. Dr. Martin Schneider-Ramelow and Katja Arnhold

Wanted: Your Opinion about the RealIZM Blog! RealIZM is Fraunhofer’s first blog on microelectronics and more: a knowledge communication platform. For three years now, we have been using our science blog to give the broader expert public a glimpse behind…

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Tagged Research Communication
PICWeld: Adhesive-free fused silica fiber joints thanks to direct laser welding
Adhesive-free fused silica fiber joints made... 0 Comments:

Adhesive-free fused silica fiber joints made possible by direct laser welding

Posted in Automotive/Transportation, Medical Engineering Published on 01/09/2022 Authors Vanessa Zamora and Jacqueline Kamp

Fused silica may be expensive and complicated to produce, but the laser welding process developed at Fraunhofer IZM, which uses it as a connection for photonic chips, is something of a revolution. Welding with a CO2 laser enables robust and…

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Tagged Laser Welding, Photonic Integration
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