FRAUNHOFER IZM SHARES ITS KNOWLEDGE

As a future-oriented research institute, we stand at the forefront of innovation in the field of microelectronics. We want to reach out and share our insights with you – Welcome to our scientific blog RealIZM! RealIZM is an online communication…

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

CHALLENGES IN DATA PROCESSING FOR IOT-BASED APPLICATIONS

Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality, unprecedented numbers of devices and machines have…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

POWER ELECTRONICS – CONVERTING CURRENTS THE MODERN WAY

Power electronics systems have to shoulder a heavy burden in terms of what is required of them and what they are expected to deliver. At Fraunhofer IZM, Stefan Hoffmann is working hard on new designs for passive and magnetic components…

HOW LIGHT CAN MAKE LIVING WITH DIABETES MORE CONVENIENT

Non-invasive blood glucose monitoring systems are one of the hottest topics in current medical technology. That is one of the reasons why the FMD space, which Fraunhofer IZM is a part of, endowed the idea of the start-up Quantune Technologies…