In early July 2026, the fourth study, »Raw Materials for Future Technologies,« was published. In collaboration with Fraunhofer ISI, Fraunhofer IZM developed projections for global demand for critical raw materials...
Fraunhofer-Blog about Microelectronics and Electronic Packaging
RealIZM is the Fraunhofer IZM science blog about microelectronics, electronic packaging, and system integration. Researchers at the institute provide insights into current developments in semiconductors, photonics, assembly and interconnect technology, reliability, sustainability, and the electronics of the future.
The blog helps professionals from industry, research, and engineering stay informed about emerging technologies, scientific advances, and innovation trends in advanced electronics.
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From Prism to Glass Interposer: UNESCO Commemorative Year Marking the 200th Anniversary of Joseph von Fraunhofer’s Death and Glass as a Key Material in Integrated Photonics
In 1826, Joseph von Fraunhofer passed away – the namesake of the Fraunhofer-Gesellschaft and a researcher who never separated science from application, but instead consistently viewed them as inextricably linked. UNESCO...













