Metallic interconnections can be hard, not only in the literal sense, but also figuratively speaking. This is why a whole research group at the Fraunhofer IZM is dedicated to understanding how to solder and sinter properly. Power electronics have upped…

Over the next ten years, major progress needs to be made in the area of conventional computing in order to keep pace with the requirements of new applications. High Performance Computing (HPC) is one option to amplify the capabilities of…

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

In 2021 alone, robots are expected to generate a turnover of over 41 billion US dollars. That is equivalent to the GDP of a medium-sized European economy. Time to take a look at robotics as a scientific discipline: What makes…

Aluminium copper bi-metal bonding wires in a trilateral transfer project funded by the DFG With more than half a century of history behind the technology, progress in wire bonding shows no signs of slowing down. For proof of the technology’s…