FRAUNHOFER IZM SHARES ITS KNOWLEDGE

As a future-oriented research institute, we stand at the forefront of innovation in the field of microelectronics. We want to reach out and share our insights with you – Welcome to our scientific blog RealIZM! RealIZM is an online communication…

A GLIMPSE INTO THE WORLD OF METALLIC INTERCONNECTIONS FOR EXTREME APPLICATIONS

Metallic interconnections can be hard, not only in the literal sense, but also figuratively speaking. This is why a whole research group at the Fraunhofer IZM is dedicated to understanding how to solder and sinter properly. Power electronics have upped…

HIGH PERFORMANCE COMPUTING – FROM VIDEOGAMES TO AUTONOMOUS CARS

Over the next ten years, major progress needs to be made in the area of conventional computing in order to keep pace with the requirements of new applications. High Performance Computing (HPC) is one option to amplify the capabilities of…

HOW TO TEST ELECTRONIC PRODUCTS FOR THE REAL WORLD? DESIGN FOR RELIABILITY

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

ROBOTICS 101: HOW SMART MACHINES ARE CONQUERING OUR WORLD

In 2021 alone, robots are expected to generate a turnover of over 41 billion US dollars. That is equivalent to the GDP of a medium-sized European economy. Time to take a look at robotics as a scientific discipline: What makes…

INFINITE POTENTIAL OF WIRE BONDING: NEW RESEARCH FINDINGS

Aluminium copper bi-metal bonding wires in a trilateral transfer project funded by the DFG With more than half a century of history behind the technology, progress in wire bonding shows no signs of slowing down. For proof of the technology’s…