Photonics and neuromorphic systems promise a paradigm shift in data processing. The PROMETHEUS project is developing computing paradigms that complement traditional electronics – with integration and packaging playing a...
Fraunhofer-Blog about Microelectronics and Electronic Packaging
RealIZM is the Fraunhofer IZM science blog about microelectronics, electronic packaging, and system integration. Researchers at the institute provide insights into current developments in semiconductors, photonics, assembly and interconnect technology, reliability, sustainability, and the electronics of the future.
The blog helps professionals from industry, research, and engineering stay informed about emerging technologies, scientific advances, and innovation trends in advanced electronics.
Latest News
Dr. Michail Symeonidis
Katja ArnholdMore News
From Prism to Glass Interposer: UNESCO Commemorative Year Marking the 200th Anniversary of Joseph von Fraunhofer’s Death and Glass as a Key Material in Integrated Photonics
In 1826, Joseph von Fraunhofer passed away—the namesake of the Fraunhofer-Gesellschaft and a researcher who never separated science from application, but instead consistently viewed them as inextricably linked. UNESCO...
Dr. Gunnar Böttger
Kevin Kröhnert
Maurice Laurent Haffner
Tom ChojneMaking Sustainability Measurable: CO₂ Accounting in the Semiconductor Industry
Sovereignty when it comes to sharing data: that would make the European semiconductor industry not only more resilient in its supply chains. It could also lay the foundations for more sustainable production processes...
Dr. Chris Eckstein
Luisa Roth
Green ICT: Efficient photoresist removal without toxic additives in a cleanroom
BASF has developed an alternative stripping agent for removing photoresist from wafers, which does not contain the commonly used highly toxic additives. Initial tests run by Fraunhofer IZM-ASSID haveyielded...
Dr. Maksym MyndykCategories
