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As head of the Life Cycle Modeling Group at Fraunhofer IZM, Chris Eckstein conducts applied research on the environmental assessment of ICT systems. With a focus on semiconductor manufacturing and data centers, he works on the development, evaluation, and standardization of methods for life cycle assessments to promote a circular economy using digital product passports (DPPs) and digital twins in industry. He has a background in environmental sciences, with a Ph.D. in technologies for nanosystems, bioengineering, and energy, as well as additional experience in the fields of nanoecotoxicology and environmental compliance management.
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3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication