As head of the Life Cycle Modeling Group at Fraunhofer IZM, Chris Eckstein conducts applied research on the environmental assessment of ICT systems. With a focus on semiconductor manufacturing and data centers, he works on the development, evaluation, and standardization of methods for life cycle assessments to promote a circular economy using digital product passports (DPPs) and digital twins in industry. He has a background in environmental sciences, with a Ph.D. in technologies for nanosystems, bioengineering, and energy, as well as additional experience in the fields of nanoecotoxicology and environmental compliance management.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication