Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM

Tag - Wafer-Level Capping

Wafer-Level Capping: A technology for encapsulating sensitive microelectromechanical components directly at the wafer level. In this process, individually patterned caps are bonded to the designated areas of a target wafer and permanently sealed. The process enables hermetic or quasi-hermetic sealing and supports the miniaturization and cost-effective manufacturing of MEMS and sensor systems. At Fraunhofer IZM, a flexible process approach is being developed for this purpose that supports customer-specific cap geometries and various bonding technologies.