6G is the sixth generation of mobile communication and planned to succeed the new 5G standard in ten years or more to increase transmission rates. 6G intends to increase transmission rates. Additionally, it will decrease latency substantially and will employ a higher frequency range. The expected frequency of over 100GHz will create higher free space losses, requiring even shorter distances between transmitters and receivers than with current standards.


The project is “Miniaturized Hardware Modules for 6G Mobile Communications (6GKom)“. Researchers are developing an ultra-wideband and miniaturized MIMO D-band (110 – 170 GHz) module with integrated beamforming capability. It bases on a scalable hardware system architecture. For this, the hardware implementation of the chip-package antenna co-design. Is uses the integration approach of Fraunhofer IZM’s fan-out wafer level packaging system integration platform. The integrated module enables data rates of several terabits per second for future 6G mobile communications as well as precise localisation applications. However, 6G is the sixth generation of mobile communication.