Al Cu bonding wires

AlCuBo is the short name for Aluminium Cupper bonding wires. Overall, The AlCuBo project develops a process. The process will be suitable for series production of AlCu composite wires by extrusion and wire drawing. The characterization of the mechanical and electrical properties provides new insights. Not only into the mechanical and thermo-mechanical cyclic strength of the wires. The aim of the project Aluminium Cupper bonding wires is the use of AlCu-composite wires. Hopefully, This applicates on the automotive sector suitable for series production and the increase of the cycle strength and current carrying capacity.  After successful completion of the development work, Al/Cu composite wires may be useful in the form of a demonstrator structure for the series production of power electronic modules.

Professor Martin Schneider-Ramelow leads the project at Fraunhofer IZM. Wire bonding has been around for more than half a century. Although, this technology still has a lot of potential for improvement – especially for power modules.

“The idea is now to develop new material compositions for heavy wire interconnections, so that we can build more reliable power modules that last longer. There are relatively few companies in the world that manufacture these wires. We tested bi-metal wires from this company, and they are suitable for wire bonding, in principle. However, because of the relatively thin Al sheath, many semiconductor chips failed during the bonding process. Now, we want to optimize the thickness of that AI sheath with the help of our colleagues at the Extrusion R&D Center. The institute tests and analyses these composites. Our hope is that we can use them to build new types of highly reliable power modules.“ (Martin Schneider-Ramelow in the interview with RealIZM)


Aluminium copper bi-metal bonding wires in a trilateral transfer project funded by the DFG With more than half a century of history behind the technology, progress in wire bonding shows no signs of slowing down. For proof of the technology’s…