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Kevin Kröhnert studied electrical engineering at the Technical University of Berlin from 2007 to 2014. He began working as a student assistant at Fraunhofer IZM in 2008. After completing his master’s degree in electrical engineering, he continued his work at Fraunhofer IZM and is now a research associate responsible for physical vapor deposition (PVD), dicing, and grinding processes. In addition, he manages the acquisition and implementation of various projects related to microtechnology, with a focus on through-glass vias (TGVs) and glass interposers.
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3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication