Kevin Kröhnert studied electrical engineering at the Technical University of Berlin from 2007 to 2014. He began working as a student assistant at Fraunhofer IZM in 2008. After completing his master’s degree in electrical engineering, he continued his work at Fraunhofer IZM and is now a research associate responsible for physical vapor deposition (PVD), dicing, and grinding processes. In addition, he manages the acquisition and implementation of various projects related to microtechnology, with a focus on through-glass vias (TGVs) and glass interposers.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
