Prof. Dr. Klaus-Dieter Lang

Klaus-Dieter Lang (M’08, SM’13, F’18) received the Dipl.-Ing. (M.Sc.) and the Dr.-Ing. (Ph.D.) degrees in electrical engineering from Humboldt University (HU), Berlin, Germany, in 1981 and 1985, respectively. In 1989, he completed his habilitation and received the Dr. sc. techn. degree in electrical engineering from HU. In 1981, he joined the Humboldt University as a researcher, where he was engaged in microelectronic assembly, packaging, and quality assurance up till 1991. In 1991, he joined SLV Hannover to build up a department for microelectronic and optical components manufacturing. In 1993, he joined the Fraunhofer-Institute for Reliability and Microintegration Berlin, IZM, and became a Group Manager for Chip Interconnections. He served as the Director’s personal assistant from 1995 to 2000, and was also responsible for Marketing and Public Relations at IZM. From 2001 to 2005, he coordinated IZM’s Branch Lab “Microsystem Engineering,” in Adlershof, Berlin. From 2003 to 2005, he was Head of the Department of “Photonic and Power System Assembly” and from 2006 to 2010, he served as the Deputy Director of IZM. Since 2010 he has been the Director of the institute, and since 2011 he has been a full professor at the Technische Universität (TU) Berlin, where he is responsible for the chair “Nano Interconnect Technologies”. He is the author and co-author of four books, and more than 350 publications in the field of wire bonding, microelectronic packaging and system integration, microsystems technologies and chip-on-board. Prof. Lang is a member of numerous scientific boards and conference committees, which include the Semiconductor Equipment and Materials International (SEMI) Award Committee, the Scientific Advisory Board of the European Cluster of Electronic Packaging and Integration of Micro Devices and Smart Systems (EURIPIDES), the Executive Board of VDE-GMM, and the Scientific Chair of the Conference “Technologies of Printed Circuit Boards” and “SMT/HYBRID/PACKAGING.” He is a member of the Deutscher Verband für Schweißen und verwandte Verfahren eV (DVS), IEEE, and the International Microelectronic and Packaging Society (IMAPS). He plays an active role in the international packaging community as well as in the organization of international conferences, e.g., the Smart System Integration (SSI) Conference. In 2017, Prof. Lang received the William D. Ashman Achievement Award from IMAPS for his exceptional contribution to the development of electronic packaging for advanced system integration worldwide. He is a Fellow, and Life Member of IMAPS, as well as a Fellow of IEEE.

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…