Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. Since 2000 she is working with the group Assembly & Encapsulation Technologies and since 2016 she is head of this group. Her field of research is process development of assembly and encapsulation processes, the qualification of these processes using both non-destructive and destructive tools and advanced polymer analysis. Recent research is focused on wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.
Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…
