Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID
For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…