Science Blog about Microelectronics of Fraunhofer IZM
RealIZM

Science Communication as a Catalyst for Innovation in Microelectronics

Professor Martin Schneider-Ramelow | © Fraunhofer IZMProf. Dr. Martin Schneider-RamelowKatja Arnhold, Fraunhofer IZMKatja Arnhold
22/09/2022
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Prize: The first microelectronics Blog at Fraunhofer
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Wanted: Your Opinion about the RealIZM Blog!

RealIZM is Fraunhofer’s first blog on microelectronics and more: a knowledge communication platform. For three years now, we have been using our science blog to give the broader expert public a glimpse behind the scenes at the Fraunhofer Institute for Reliability and Microintegration IZM.

At the same time, we offer researchers, experts, and other interested contributors a platform to enter into a digital dialog with each other that can power innovation in microelectronics. This unique approach has been met with a great reception in the field and has won a German Research Foundation award in the “International Research Marketing Ideas Competition”, right on time to mark our third anniversary.

Our winning bid for the “Ideas Competition International Research Marketing” of the German Research Foundation (DFG) was originally for the year 2019, but due to the pandemic, the award ceremony was rescheduled to take place in Berlin on September 21, 2022. On behalf of the editorial team, I accepted the award from Dr. Harald von Kalm, Head of Department of International Affairs and Integrative Activities, at the BMBF forum “Research-in-Germany”.

Speaking for the editorial team, I would like to take this opportunity to thank you, our readers and authors: A science blog only works if it offers high-quality content, content that is also read and sparks a digital debate and more collaboration with researchers and experts from all over the world. With 58 experts, we have now published more than 60 articles. So far, we have been able to inspire 400 newsletter subscribers with our contributions. Thank you for your participation and support!

I encourage you to take advantage of the opportunity that our blog continues to offer you. Reach out to other scientists, innovators, and visionaries from across the globe. Start a conversation and share your experiences.

Our editorial team is interested in your opinions

We always want to become even better, which is why I would like to ask you to participate in our survey. With your vote, you have the opportunity to help shape RealIZM. I would be pleased if you took a moment and sent us your feedback by October 7, 2022.

Find our survey here!

Thank you, and here’s to an exciting fourth year!

Professor Martin Schneider-Ramelow

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Professor Martin Schneider-Ramelow | © Fraunhofer IZM

Prof. Dr. Martin Schneider-Ramelow

Professor Martin Schneider-Ramelow has established himself as one of the leading microelectronics researchers and teachers in Germany. Since 2014, he has held an honorary professorship at TU Berlin and, since January 2017, a professorship for "Materials of Hetero-System Integration" at the Institute for High Frequency and Semiconductor System Technologies at the Faculty IV Electrical Engineering and Computer Science at TU Berlin, heading the research focus Technologies of Microperipherics.

Since 2023, Martin Schneider-Ramelow has been the institute director at Fraunhofer IZM, where he works on the thematic-strategic orientation of the institute's activities, the further development of the institute within the framework of the European Chips Act Initiative and the deepening of cooperation with universities and institutes. He also is a strong advocate for the more than 400 employees and their further development. As a professor, he supervises numerous doctoral and graduate students and develops mentoring programs and personnel coaching.

Martin Schneider-Ramelow is author and co-author of more than 250 technical articles. He is considered a specialist in the field of quality and reliability of metallic interconnects and is recognized worldwide as an expert in wire bonding. For example, as chairman of Working Group 2.4 "Bonding" for the German Welding Society (DVS), he was instrumental in rewriting DVS Standard 2811, which is more than 20 years old and has been the basis for evaluating high-quality wire bond connections since 2017.

Furthermore, he is a member of six national and international conference program committees in the field of electronic packaging, Senior Member of IEEE, Fellow of IMAPS USA and, for 14 years, First Chairman of the International Microelectronics and Packaging Society (IMAPS) Germany.

View all postsmartin.schneider-ramwlow@izm.fraunhofer.de +49 30 46403-172
Katja Arnhold, Fraunhofer IZM

Katja Arnhold

Katja Arnhold is editorially responsible for Fraunhofer IZM's RealIZM blog.

Katja has 20 years of experience in corporate communications and B2B marketing. She has worked for two private weather service providers and for the world market leader in premium alcoholic beverages, among others. She studied communication and media sciences, business administration and psychology at the University of Leipzig, holds a master degree and is a member of the Leipzig Public Relations Students Association (LPRS).

View all postsKatja.Arnhold@izm.fraunhofer.de +49 30 46403-213

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