Dr.-Ing. Torsten Mehlhorn has worked as Innovation Manager at Fraunhofer IPMS and at iCampµs Cottbus until 2023. He worked for several years as Head of Business Development at the Fraunhofer Heinrich Hertz Institute and as Key Account Manager ICT at Investitionsbank Berlin.
He was also Head of International R&D Projects and Change Management at Siemens AG. Torsten Mehlhorn earned his doctorate in electrical engineering and electronics at the Technical University of Berlin.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication