Dr.-Ing. Torsten Mehlhorn has worked as Innovation Manager at Fraunhofer IPMS and at iCampµs Cottbus until 2023. He worked for several years as Head of Business Development at the Fraunhofer Heinrich Hertz Institute and as Key Account Manager ICT at Investitionsbank Berlin.
He was also Head of International R&D Projects and Change Management at Siemens AG. Torsten Mehlhorn earned his doctorate in electrical engineering and electronics at the Technical University of Berlin.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
