Christoph Marczok studied mechatronics at the Beuth University of Applied Sciences in Berlin, earning a Master of Engineering degree with a focus on precision systems technology and quality management. He has been a research associate in the Power Electronics department at Fraunhofer IZM since 2010, working on the development of power modules based on fast-switching SiC and GaN power semiconductors.
He has been able to apply and expand his experience successfully in numerous industrial and publicly funded projects. His greatest success to date was winning the Young Engineer Award at the power electronics conference PCIM 2019 with the topic »Low inductive SiC mold module with direct cooling«.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
