Dipl.-Ing. Lars Böttcher is the research and development engineer at the helm of the "Embedding and Substrate Technologies" working group at Berlin’s Fraunhofer Institute for Reliability and Microintegration IZM. He specializes in the development of build-up processes, specifically for PCB manufacturing.
In his work, he is responsible for EU-funded projects as well as work with industry partners, always revolving around new packaging technologies based on embedded chips and novel substrate technologies.
Lars Böttcher is an active member of the Surface Mount Technology Association (SMTA) and the International Microelectronics Assembly and Packaging Society (IMAPS). He is also part of the technical committee for the SMTA International Conference and the IMAPS Device Packaging Conference.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication