Dipl.-Ing. Lars Böttcher is the research and development engineer at the helm of the "Embedding and Substrate Technologies" working group at Berlin’s Fraunhofer Institute for Reliability and Microintegration IZM. He specializes in the development of build-up processes, specifically for PCB manufacturing. In his work, he is responsible for EU-funded projects as well as work with industry partners, always revolving around new packaging technologies based on embedded chips and novel substrate technologies. Lars Böttcher is an active member of the Surface Mount Technology Association (SMTA) and the International Microelectronics Assembly and Packaging Society (IMAPS). He is also part of the technical committee for the SMTA International Conference and the IMAPS Device Packaging Conference.
The new generations of semiconductors with a wider band gap (WBG), such as silicon carbide (SiC), have the potential to put electric mobility in the fast lane. This is because they yield significantly higher efficiency compared to conventional silicon IGBT…
