After completing his training as a physics lab technician, Steve studied physical engineering at today’s Berliner Hochschule für Technik, already spending more than 2 years as an undergraduate assistant at Fraunhofer IZM, working in thermocompression bonding. After successfully completing his studies, he worked for ten years at the TU Berlin in a cooperation with IZM in electronic packaging on organic substrates. In January 2019, Steve joined Fraunhofer IZMs group for assembly & encapsulation, while studying computer science part time.
RealIZM blog series “Hardware security” – Part 2 Making sure that electronic components and assemblies are genuine and fully traceable through their production chain, the researchers active in the SiEvEI 4.0 project are putting several protection mechanisms to use. Among…
Modern society is relying more and more on connected, digitalized, and automated technology – an epochal change that touches on all aspects of business life, including the manufacturing of products. Fraunhofer IZM is at the forefront of this trend, creating…
