Semiconductors

In the business field of semiconductors at Fraunhofer IZM, the focus lies on the integration and the manufacture of sensors. 3D integration enables the realization of complex, heterogeneous System-in-Package solutions.

The major advantages of 3D system architecture include the high miniaturization and improved form factor. It also includes Improved performance and power efficiency. This is due to the faster signal speeds and higher bandwidth via shorter and narrower signal paths. 3D system architecture also increases functionality due to heterogeneous integration of components. Those components are fabricated using various technologies (sensor, memory, ASIC and transceiver).

Fraunhofer IZM’s services include a closed process chain – concept and process development and characterization. Additionally, reliability assessment and prototyping of 3D systems. Our labs provide all processes required throughout the chain for the realization of wafer-level packages. This includes silicon via (TSV) formation. Image sensors, sensor nodes and eGrains are some examples for various application scenarios. The realization and characterization of those 3D systems that meet the disparate target profiles is possible at Fraunhofer IZM.

How to Test Electronic Products for the Real World? Design for Reliability

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

Panel Level Packaging Consortium 2.0 – Moving to the Next Level

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

Power Electronics – Converting Currents the Modern Way

Power electronics systems have to shoulder a heavy burden in terms of what is required of them and what they are expected to deliver. At Fraunhofer IZM, Stefan Hoffmann is working hard on new designs for passive and magnetic components…

Three Disruptive Technologies in Microelectronics

Welcome to our list of three disruptive technologies in microelectronics. This post will let you discover the trends that will significantly change the global technological development. Chips Embedded in Substrate It is hard to miss the unbroken trend towards ever-smaller…

Pixel Detectors – The Smallest Pieces in the World’s Largest Particle Collider

Pixel detectors made by Fraunhofer IZM are used in one of the largest and best known scientific centers worldwide. Since the discovery of the Higgs Boson in 2012, the researchers at CERN have been pursuing other groundbreaking discoveries. Thomas Fritzsch…

The Way to Reduce Your Environmental Risks

RealIZM recently interviewed Dr. Max Marwede, a researcher at Fraunhofer IZM and active proponent of the circular economy. He told us about ways to change the traditional linear economy by committing to the principles of the circular economy that can…

Is Heterogeneous Integration a Panacea for the Electronics Industry?

According to experts, heterogeneous integration increases not only the degree of miniaturization, but also the functional density of microelectronics. This approach could be a solution for companies in a vast range of industries, vying for competitive advantages in their market…

Will Chiplets Revive Moore’s Law?

Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…