Tag - Semiconductors

In this business area, the focus is on the integration and manufacture of sensors, with 3D integration enabling the realization of complex, heterogeneous system-in-package solutions.

Fraunhofer IZM offers its customers a closed implementation chain – from design, process development and characterization to reliability evaluation and prototyping of new sensors, hermetic sensor packages and 3D systems. All necessary processes for the realization of sensors and wafer-level packages, including the formation of through-silicon vias (TSVs), are available.