Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM
Andreas Brüning | © Fraunhofer Mikroelektronik

Dr. Andreas Brüning

Andreas Brüning studied electrical engineering/communications engineering at Kiel University of Applied Sciences. In his career, he has worked as a development engineer at Philips Semiconductors/NXP, as Head of the Engineering Support Center at sci-worx GmbH and as Director Technology Office at ZMD AG with a focus on analog design methodology, physical realization, design flow, and test engineering.
He later headed the Efficient Electronics department and was Chief Engineer at the Fraunhofer Institute for Integrated Circuits IIS, Adaptive Systems Engineering branch EAS. Since 2008, he has been active in the Silicon Saxony e.V. association, initially many years as Head of the IC Design working group and, since 2015, on the scientific advisory board. Since 2023, he has been a senior expert for the design of microelectronic systems at the Research Fab Microelectronics Germany (FMD).

andreas.bruening@mikroelektronik.fraunhofer.de