Automotive/Transportation

Automotive/Transportation – Core competence at Fraunhofer IZM

The application areas automotive and transportation technologies are core competences of Fraunhofer IZM since it’s establishment. Automotive driving and new ways of transportation, especially in urban areas, are hot topics all over the industry. The institute has worked with OEMs, tier 1s and, in particular, their suppliers.

Fraunhofer IZM intends to “electronify” the automobile at all levels. We develop innovative, cost-efficient and reliable solutions. This includes the prototype level, for conventional, hybrid and electric drive engineering and safety and comfort systems. 

The field of application consists of different competences: Sensor and actuator technology, Power electronics, Reliability management and assurance and Robust design.

Automotive/Transportation – core competence at Fraunhofer IZM

CARBON-BASED MATERIALS – A WINDOW TO THE NEW REALITY OF FLEXIBLE ELECTRONICS

Materials science is one of the key disciplines for product development, where it promises a wide range of solutions for many pressing challenges, especially in novel technologies that are set to dominate the markets of the future. Carbon-based materials in…

A GLIMPSE INTO THE WORLD OF METALLIC INTERCONNECTIONS FOR EXTREME APPLICATIONS

Metallic interconnections can be hard, not only in the literal sense, but also figuratively speaking. This is why a whole research group at the Fraunhofer IZM is dedicated to understanding how to solder and sinter properly. Power electronics have upped…

HIGH PERFORMANCE COMPUTING – FROM VIDEOGAMES TO AUTONOMOUS CARS

Over the next ten years, major progress needs to be made in the area of conventional computing in order to keep pace with the requirements of new applications. High Performance Computing (HPC) is one option to amplify the capabilities of…

HOW TO TEST ELECTRONIC PRODUCTS FOR THE REAL WORLD? DESIGN FOR RELIABILITY

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

ROBOTICS 101: HOW SMART MACHINES ARE CONQUERING OUR WORLD

In 2021 alone, robots are expected to generate a turnover of over 41 billion US dollars. That is equivalent to the GDP of a medium-sized European economy. Time to take a look at robotics as a scientific discipline: What makes…

INFINITE POTENTIAL OF WIRE BONDING: NEW RESEARCH FINDINGS

Aluminium copper bi-metal bonding wires in a trilateral transfer project funded by the DFG With more than half a century of history behind the technology, progress in wire bonding shows no signs of slowing down. For proof of the technology’s…

ECO-RELIABILITY: THE NEW APPROACH TOWARDS SUSTAINABLE AND RELIABLE ELECTRONICS

Driven by the digital and ecological transition, the term “eco-reliability” has gained increased popularity within the last years. The main objective of this article is to present this new approach from its complementary perspectives “ecology and reliability” and to highlight…

6G IS COMING TO MAKE GOOD ON THE PROMISES OF 5G

A new era of mobile communication is about to begin: Transmitting a whole terabit of data, one thousand gigabits, per second. Dr. Ivan Ndip, specialist for antenna and high-frequency systems at the Fraunhofer Institute for Reliability and Microintegration IZM in…

POWER ELECTRONICS – CONVERTING CURRENTS THE MODERN WAY

Power electronics systems have to shoulder a heavy burden in terms of what is required of them and what they are expected to deliver. At Fraunhofer IZM, Stefan Hoffmann is working hard on new designs for passive and magnetic components…

LOW POWER AND COMMUNICATIVE MICROSYSTEMS: TURNKEY SOLUTION FOR INDUSTRY

In factories, cars, agriculture, medicine – microsystems are used everywhere. Julia Günther-Sorge, a researcher on microperipheric technologies at the Technical University of Berlin and member of the Sensor Nodes & Embedded Microsystems group working in cooperation with Fraunhofer IZM, has…