Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM
Michael Schiffer | © Fraunhofer IZM

Dr.-Ing. Michael Schiffer

Dr. Michael Schiffer received his diploma in electrical engineering with focus on microsystems technology in 2003, and his doctorate degree with distinction for the development of a MEMS mass flow controller in 2010, both at the Technical University in Berlin. In 2009, he worked for TDK Sensors as a product developer for the MEMS pressure sensors, where he later headed process development and operations.

Since 2018 he worked at Fraunhofer IZM and since 2019 he has been the head of the department »Wafer Level System Integration« with around 50 employees. His particular interests are innovative 2.5D/3D system integration technologies and the further development of MEMS and electro-optical systems.

michael.schiffer@izm.fraunhofer.de +49 30 46403-234