Dr. Andreas Ostmann

Dr. Andreas Ostmann heads the System Integration and Interconnect Technologies department at Fraunhofer IZM. For more than 25 years, he and his working group have been dedicated to embedding electronic components in printed circuit boards. The technologies they have developed are now used worldwide, including processes for chemical metallization of flip chip dies. He studied applied semiconductor physics at the Technical University of Berlin and completed his doctorate in microsystems technology.

E-pills: A new approach to diagnosing and treating gastrointestinal conditions

The gastrointestinal tract is of great importance to our health and wellbeing, but many patients are wary about the endoscopic exams that they often associate with considerable discomfort. And indeed, in many cases, the current methods require general anesthesia and…