M.Sc. Eduard Wagner joined Fraunhofer IZM in 2013, in the »Environmental and Reliability Engineering« department’s research group on »Sustainable Networks and Computing« with its special focus on digitization and sustainability. In his work, he explores whether and how data from the product life cycle can be used to improve product circularity and sustainability.
He has led and contributed to various flagship projects related to the digital product passport (or DPP), and continues to do so in his current work: in the EU project »CIRPASS 2«, he worked on evaluating the environmental and circularity impact of the DPP, in the EU CSA project »CIRPASS« on developing a data infrastructure for European DPPs, in the UBA project »Product Information 4.0« on identifying gaps in current legal information, in the »PACT NEW3« project on pinpointing the manufacturing data relevant for DPPs as well as industry projects dedicated to requirements specific to a sector or product group.
Currently, he is co-developing the DPP-specific ecodesign requirements as part of the preparatory studies for the EU’s delegated acts. In another projects(EU Horizon Europe »INCREACE«), he is in charge of the work package on »Circular product design« with a special focus on the recyclability of plastics in WEEE collection.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
