Science Blog about Microelectronics and Electronic Packaging of Fraunhofer IZM
Prof. Dr.-Ing. Juliana Panchenko | © Fraunhofer IZM | Juergen Loesel

Prof. Dr.-Ing. Juliana Panchenko

Juliana Panchenko has been Professor of Electronics Packaging at Dresden University of Technology since November 1, 2025. Previously, she headed the »Micro-Nano Interconnect« research group in the »Wafer-Level System Integration« department at Fraunhofer IZM-ASSID.

She completed her studies in microelectronics at the National Technical University of Ukraine in Kiev. During a research stay at the Institute for Electronics Assembly and Interconnection Technology (IAVT) at TU Dresden, she focused on the microstructural investigation of lead-free solder materials. In 2013, she received her doctorate from the IAVT and subsequently took on a junior professorship for »Nanomaterials for Electronics Packaging«.

At Fraunhofer IZM-ASSID, Professor Panchenko was responsible for, among other things, the joint project »Tech-for-Trust (T4T),« which deals with distributed manufacturing approaches for trustworthy electronics. Her research focused on technologies such as wafer bumping using electroplating, hybrid bonding, and chiplet integration.