Tag - Flip-Chip

Chip-to-chip or chip-to-subtrate (e.g. laminates, thinfilm ceramics) can offer Flip-Chip Assembly. Chip-to-wafer assembly especially dedicated for 3D integration is possible for wafers up to 300 mm in diameter. Beside permanent die attach the Institute developed temporary die bonding methods to form artificial reconfigured wafers for wafer-to-wafer bonding. The team also developed Solutions for thin chip handling, as well as for very small chips by collective bonding methods.

Due to great progress in material and process development in the field of adhesive bonding technology, it now accounts for a growing share of joining technologies, e.g. alongside soldering processes. The result is the spread of application fields for adhesive bonding technology. These range from so-called low-cost products in consumer electronics to high-tech applications, e.g. in medical technology. The focus is on the application and development of flip chip bonding technologies. The basis for that are the following processes: ansiotropic conductive adhesive, non conductive adhesive or isotropic conductive adhesive.