The backbone of our digital world is made of glass: A network of optical fibers spans the globe and lets data criss-cross our globe. We also experience the digital world through a pane of glass: We interact with the...
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Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID
For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV...