For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV...
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Dr. Manuela Junghähnel
Susann Thoma
Dipl.-Ing. Karsten Schischke
Katja ArnholdScience Communication as a Catalyst for Innovation in Microelectronics
Wanted: Your Opinion about the RealIZM Blog! RealIZM is Fraunhofer’s first blog on microelectronics and more: a knowledge communication platform. For three years now, we have been using our science blog to give...
Prof. Dr. Martin Schneider-Ramelow
Adhesive-free fused silica fiber joints made possible by direct laser welding
Fused silica may be expensive and complicated to produce, but the laser welding process developed at Fraunhofer IZM, which uses it as a connection for photonic chips, is something of a revolution. Welding with a CO2...
Dr. Vanessa Zamora
Jacqueline Kamp