Automotive/Transportation

Automotive/Transportation – Core competence at Fraunhofer IZM

The application areas automotive and transportation technologies are core competences of Fraunhofer IZM since it’s establishment. Automotive driving and new ways of transportation, especially in urban areas, are hot topics all over the industry. The institute has worked with OEMs, tier 1s and, in particular, their suppliers.

Fraunhofer IZM intends to “electronify” the automobile at all levels. We develop innovative, cost-efficient and reliable solutions. This includes the prototype level, for conventional, hybrid and electric drive engineering and safety and comfort systems. 

The field of application consists of different competences: Sensor and actuator technology, Power electronics, Reliability management and assurance and Robust design.

Automotive/Transportation – core competence at Fraunhofer IZM

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

Wafer-Level-Systemintegration auf 300mm – Kernkompetenz des Fraunhofer IZM-ASSID

Seit mehr als 10 Jahren betreibt das Zentrum „All Silicon System Integration Dresden – ASSID“ eine hochmoderne, industrietaugliche 200/300mm 3D-Wafer-Level-Prozesslinie mit Modulen für TSV-Bildung, Vormontage (Ausdünnen, Vereinzeln), Wafer-Level-Montage und Stapelbildung. Das ASSID ist Teil des Fraunhofer IZM. Und seine Philosophie…

Adhesive-free fused silica fiber joints made possible by direct laser welding

Fused silica may be expensive and complicated to produce, but the laser welding process developed at Fraunhofer IZM, which uses it as a connection for photonic chips, is something of a revolution. Welding with a CO2 laser enables robust and…

Klebstofffreie Quarzglas-Faser-Verbindungen dank direktem Laserschweißen

Quarzglas ist teuer und kompliziert herzustellen. Trotzdem ist das am Fraunhofer IZM entwickelte Laserschweißverfahren, bei dem Quarzglas als Verbindung für photonische Chips benutzt wird, eine kleine Revolution. Durch das Schweißen mit einem CO2-Laser können robuste und langhaltende Verbindungen klebstofffrei an…

Weltraumelektronik – Fit für den Orbit

Der Weltraumvertrag von 1967 regelt: „Jede Nation hat freien Zugang zum All.“ Seit zirka 20 Jahren starten immer mehr Nationen mit kommerziellen Projekten in den Weltraum. Private Raumfahrtunternehmen planen, mit Mikro– und Nanosatelliten z.B. die weltweite lückenlose Internetversorgung zu erreichen….

Space Electronics – Fit for Orbit!

The Outer Space Treaty of 1967 stipulates that every nation enjoys free access to space. For the last 20 years, more and more nations have been launching commercial projects in space. Private spaceflight companies are planning to use micro and…

A Pedestrian Or Just A Beverage Can? Helping Self-Driving Cars Recognize Objects With Cameras and Radars Combined

Autonomous driving is getting better with every technological advance. But for driverless cars to become truly safe in traffic, they need a sensor system that recognises objects in the street – reliably and with no margin for error. Christian Tschoban…

Meet 6G’s Future with Holographic Communication

5G is not fully rolled out yet, but Fraunhofer IZM is already pursuing research on 6G communication modules. As these modules must be distributed more densely, the hardware has to become more compact. Finding the right way to miniaturize modules…