Paul Perlwitz studied biomedical engineering at the Anhalt University of Applied Sciences as well as applied physics at BHT in Berlin, graduating in 2017 with a master's degree, completed at Fraunhofer IZM.
He then started as a research assistant in the R3S department and was employed at TU Berlin's Center for Microperipherivic Technologies, which is linked to Fraunhofer IZM via a cooperation agreement. Since 2025 he works at Fraunhofer IZM and is involved in the development, design, and assembly of RF modules, focusing in particular on radar technology.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
