Paul Perlwitz studied biomedical engineering at the Anhalt University of Applied Sciences as well as applied physics at BHT in Berlin, graduating in 2017 with a master's degree, completed at Fraunhofer IZM.
He then started as a research assistant in the R3S department and is now employed at TU Berlin's Center for Microperipherivic Technologies, which is linked to Fraunhofer IZM via a cooperation agreement. He is involved in the development, design, and assembly of RF modules, focusing in particular on radar technology.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Labels Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication