Karl-Friedrich Becker studied materials science at Technical University of Berlin with a focus on polymer physics. He finished his studies in 1995 with a degree Dipl.-Ing. Materials Science. In 1996, he joined Fraunhofer IZM, since 2001, he is heading the group Assembly & Encapsulation in the department System Integration and Interconnect Technologies. Focus of his research are advanced packaging and interfaces towards industrial IoT/ process digitalization.
RealIZM blog series “Hardware security” – Part 2 Making sure that electronic components and assemblies are genuine and fully traceable through their production chain, the researchers active in the SiEvEI 4.0 project are putting several protection mechanisms to use. Among…
A 50,000 square meter artificial reef off the Baltic coast and a green space following the trajectory of the Berlin Wall: Two places, about 240 km apart from each other and as different as could be. However, only a few…
