Tolga Tekin has completed his Ph.D. in electrical engineering and computer science at the Technical University of Berlin in 2004, before beginning his career as a research scientist in Fraunhofer HHI’s Optical Signal Processing department, where he was engaged in advanced research on optical signal processing, 3R regeneration, all-optical switching, clock recovery, and integrated optics.
His postdoctoral work continued as a post-doc researcher working on components for O-CDMA and terabit routers at the University of California, followed by work on phased-array antennas and their components for skyDSL at Teles AG. At the Fraunhofer Institute for Reliability and Microintegration IZM, he initially conducted projects on optical interconnects and silicon photonics packaging, continuing with work on microsystems, photonic integrated system-in-package technology, photonic interconnects, and 3D heterogeneous integration at the TU Berlin.
He currently works as a Group Manager for Photonics and Plasmonics Systems at Fraunhofer IZM and is the coordinator of the ‘PhoxLab - European Photonics Innovation Hub for Optical Interconnects‘ at the Institute, continuing his coordinating work from the European flagship project on optical interconnects ‘FP7-PhoxTroT’, ‘H2020-L3MATRIX’ and the on-going ‘H2020-MASSTART’ project.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication