Tolga Tekin has completed his Ph.D. in electrical engineering and computer science at the Technical University of Berlin in 2004, before beginning his career as a research scientist in Fraunhofer HHI’s Optical Signal Processing department, where he was engaged in advanced research on optical signal processing, 3R regeneration, all-optical switching, clock recovery, and integrated optics.
His postdoctoral work continued as a post-doc researcher working on components for O-CDMA and terabit routers at the University of California, followed by work on phased-array antennas and their components for skyDSL at Teles AG. At the Fraunhofer Institute for Reliability and Microintegration IZM, he initially conducted projects on optical interconnects and silicon photonics packaging, continuing with work on microsystems, photonic integrated system-in-package technology, photonic interconnects, and 3D heterogeneous integration at the TU Berlin.
He currently works as a Group Manager for Photonics and Plasmonics Systems at Fraunhofer IZM and is the coordinator of the ‘PhoxLab - European Photonics Innovation Hub for Optical Interconnects‘ at the Institute, continuing his coordinating work from the European flagship project on optical interconnects ‘FP7-PhoxTroT’, ‘H2020-L3MATRIX’ and the on-going ‘H2020-MASSTART’ project.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
