Bogdan Sirbu received his degree in telecommunications engineering from the Politecnica University of Madrid in 2012. He is currently pursuing his PhD thesis plasmonics and photonics research at the Technical University of Berlin, while also working as a research scientist with the Photonics and Plasmonics Systems group at Fraunhofer IZM. In this role, he is active in research on optical interconnects technologies for data centre applications, optical printed circuit boards, 3D heterogeneous integration, and the packaging of optical systems.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Labels Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication