Bogdan Sirbu received his degree in telecommunications engineering from the Politecnica University of Madrid in 2012. He is currently pursuing his PhD thesis plasmonics and photonics research at the Technical University of Berlin, while also working as a research scientist with the Photonics and Plasmonics Systems group at Fraunhofer IZM. In this role, he is active in research on optical interconnects technologies for data centre applications, optical printed circuit boards, 3D heterogeneous integration, and the packaging of optical systems.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
