Professor Martin Schneider-Ramelow has established himself as one of the leading microelectronics researchers and teachers in Germany. Since 2014, he has held an honorary professorship at TU Berlin and, since January 2017, a professorship for "Materials of Hetero-System Integration" at the Institute for High Frequency and Semiconductor System Technologies at the Faculty IV Electrical Engineering and Computer Science at TU Berlin, heading the research focus Technologies of Microperipherics.

Since 2023, Martin Schneider-Ramelow has been the institute director at Fraunhofer IZM, where he works on the thematic-strategic orientation of the institute's activities, the further development of the institute within the framework of the European Chips Act Initiative and the deepening of cooperation with universities and institutes. He also is a strong advocate for the more than 400 employees and their further development. As a professor, he supervises numerous doctoral and graduate students and develops mentoring programs and personnel coaching.

Martin Schneider-Ramelow is author and co-author of more than 250 technical articles. He is considered a specialist in the field of quality and reliability of metallic interconnects and is recognized worldwide as an expert in wire bonding. For example, as chairman of Working Group 2.4 "Bonding" for the German Welding Society (DVS), he was instrumental in rewriting DVS Standard 2811, which is more than 20 years old and has been the basis for evaluating high-quality wire bond connections since 2017.

Furthermore, he is a member of six national and international conference program committees in the field of electronic packaging, Senior Member of IEEE, Fellow of IMAPS USA and, for 14 years, First Chairman of the International Microelectronics and Packaging Society (IMAPS) Germany.